Integrated Circuit (IC) Inspection
During various step in semiconductor manufacturing, Integrated circuit needs to be inspected. And when the chip fail, the cause of failure needs to be known so that corrective action can be taken. At the package level, many things needs to be inspected such as the solder quality, The mold quality, the wire bond quality, the leg quality etc. For an overview of the package, the magnification of SMZ745T (6.7X to 50X) is ideal for an overview inspection. Sometime, the metal surface of the solder or leg can be too reflective. This can significantly improved by using the co-axial light attachment. The SMZ745T is mostly coupled with our own MioCam HD+ camera to get the Full HD image onto a full HD monitor screen. We normally compare our system to digital microscope system such as VHX-6000 or VHX-5000. While VHX-6000 and VHX-5000 are great systems with many fascinating functions. Many of our customer tell us that they need only basic functions. With the SMZ745T and MioCam HD+, the superior image quality can be achieve at a fraction of the price of VHX-6000 or VHX-5000.