Overview
NEXIV VMZ-K3040 – Ground-breaking multi-functional confocal video measuring system. It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need–two-dimensional or three-dimensional–inspection and evaluation is exceptionally fast and accurate with this system! The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.
 
Key Benefits:
– Simultaneous wide-area height measurement with Nikon proprietary confocal optics
– 2D measurement with 15x brightfield zoom optics
– Fully compatible with 300 mm wafer measurement at semiconductor fabs
– General model for a wide range of needs
 
Applications:
– IC Packages: Flip Chip/COF(Bump)/COG, CSP (FBGA)/SIP (Bump, Wire), Interposer (Pad height)
– MEMS
– Probe Card (Silicon Probe, Au Probe)
– Precise Glass Components (Micro Lens, Contact Lens)
– Photo Spacer Width/Height for Color Filter for FPD Panel

Benefits & features

Measurement examples

Confocal objective lenses
Confocal Objective Lenses Type-S: 1.5x – W.D. 35mm, 3x – W.D. 24mm, 7.5x – W.D. 5mm
Confocal Objective Lenses Type-H: 15x – W.D. 20mm, 30x – W.D. 5mm